Hi,

 I would like to find out some of the ways, MEMS wafers (SOI in particular)
are diced after processing. Due to the exposed and released structure,
problems with stiction and debris are often encountered thus reducing yield
significantly. Traditional diamond saw is quite hopeless or even impossible
without major change to the process step. Scribing and snapping through a
etched scribe mark is a preferred way for many but still pose a problem for
SOI wafers.
 From your experience, how does one dice processed wafers? I hope all those
who have encountered this difficulty and have overcome them in some way or
the other, could share their experience with the rest of us.
 Thank you.

Cheers,
David Ng
Research Officer,
Institute of Materials Research and Engineering (IMRE)
www.imre.org.sg 
tel.: 65 8748151 fax.: 65 872 0785