Dear MEMS friends:

I am trying to plate transition metals (Fe, Co, Ni) on Cr films
deposited (sputtered) on n-Si. Electrical contact is made from the
front, so conductivity should be guaranteed.
I cannot obtain any deposit at normal current densities (5 to 50
mA/cm^2). If I go in voltage control and use a voltage high enough
to evolve hydrogen, the deposit is there but in powdery form, with
very low adhesion.
I am using simple Me sulfate 0.1M + boric acid 0.4 M, pH 2 to 4,
electrolytes.
I have been trying several etching techniques for Cr assuming that
it was the oxide layer on it, but that doesn't improve the quality of
the deposit.

Does anybody have any suggestion on how to achieve plating on
Cr? (different solutions, Cr etching methods, etc.)

Thank you in advance for your help,

    Giovanni

===================================================
Dr. Giovanni ZANGARI
Assistant Professor
Dept. of Metallurgical and Materials Engineering
University of Alabama
P.O. Box 870202, 120 Bevill Building
Tuscaloosa, AL 35487
Phone:  (205) 348-7074
Fax:    (205) 348-2164
e-mail: [email protected]