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Zhengwei,

It is not a good idea to thin Si wafers with KOH due to its anisotropic etch
of Si.  I am afraid that I can not provide any help on KOH etching.
However, I know of  one method of thinning wafers, that is, mechanical
grinding.  There are several commercial services in the United States such
as Virginia semiconductor and Spin Technologies.  Yield is an issue however
since 100 micron thick Si wafers are very fragile.

Good Luck,

zw wrote:

> Dear colleagues,
>
> Now I am working on etching silicon wafer with KOH. I want to reduce the
> thickness of silicon wafer to about 100 microns. But I found, after that
> process
> the surface of silicon became so worse that I could not continue my
> work.
>
>  Anyone can help me on  KOH etching techniques?
> Thank you very much!
>
>                                                               zhengwei
>
> zw@itsvr.sim.ac.cn
>
>

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