Dear MEMS experts,

I would like to get some advice about Au wire bonding, as I am new to
 the field of packaging.

I wish to bond to Al pads on my chip, sputter-deposited onto PZT films
(1 micron thick).  I have tried this, but have so far failed: either
the first ball bonding does not stick to my Al film, or this film
sticks to the Au wire and lifts off from the PZT film surface.  I have
tested different power and time settings, but again, all in vain.

I am using 1000A thick Al pads, and I am slightly reluctant to use a
thicker film, since the whole structure is already rather stressed.

Any comments, suggestions, and information, like the conventional film
thickness range and materials used for top metallisation, are most
welcome. I thank you all for your time.

Marvin


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