hello,

we are trying to bond a silicon wafer to an alumina substrate, but the
previous experiments were not a success. (we already tried with a
nitride intermediate layer (on low and on high temperature) and with an
undoped pyrox layer at low temperature)

Is there anybody who has some experience with the bonding topics or
somebody who's got usefull information? All information and tips are
welcome!

Thanx a lot.

Stijn
University KULeuven (belgium)