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There are countless academic research teams and corporations investigating=
 the
"reliability" and performance of their MEMS devices.  However, I suspect=
 that
you will find nationally and internationally accepted standards for MEMS
difficult to find at this time.  Compared to integrated circuit device
standards and test methods,  mechanical property characterization of films=
 is
in its infancy.  However, efforts are underway at organizations like ASTM to
address the need for standard test methods and specifications for the
mechanical properties of films.  Appended below is a brief description of=
 the
task group.  If you are interested in more information about ASTM task group
E080503 on Structural Films and Electronic Materials and its ongoing round
robins and standards development, please contact me at
[email protected].

Regards,
Chris
E08.05.03 on Structural Films and Electronic Materials

Task group E08.05.03 on Structural Films and Electronic Materials develops
standards for electronic and micromechanical applications.  Technical issues
include developing techniques for evaluating mechanical properties of=
 interest
to the microelectronics and microelectromechanical system (MEMS) industries.
Current activities include:

=B7       Residual Stress Measurement Round Robin
=B7       Symposia and Workshops
=B7       Fatigue of Solder Studies
=B7       Mechanical Properties of Structural Films

Calendar of Events

Workshop on Fatigue and Fracture of Structural Films (November 17, 1999)
Symposium on Mechanical Properties of Structural Films (November 15-16,=
 2000)

For more information contact:
Chris Muhlstein
LBNL
1 Cyclotron Road
MS 62-203
Berkeley, CA  94720
[email protected]


At 01:07 PM 3/24/99 +0000, you wrote:
>Hello All,
>
>I'm looking for MEMS' specific reliability and long-term stability
>standards, models, test methods and experimental results. Bulk
>micromachined sensors with anodic or fusion bonded wafers (acceleration
>sensors, pressure sensors) are from special interest. Any informations and
>suggestions will be deeply appreciated.
>
>Sincerely,
>Roumiana
>      =20
>       Dr. Roumiana Paneva
>              =20
>       X-FAB GmbH
>       Haarbergstasse 61
>       D-99097 Erfurt
>       Deutschland
>       Tel: (+49) 361 42 053 21
>       FAX: (+49) 361 42 053 11
>      =20
>=20
> =20
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There are countless academic research teams and corporations
investigating the "reliability" and performance of their MEMS
devices.  However, I suspect that you will find nationally and
internationally accepted standards for MEMS difficult to find at this
time.  Compared to integrated circuit device standards and test
methods,  mechanical property characterization of films is in its
infancy.  However, efforts are underway at organizations like ASTM
to address the need for standard test methods and specifications for the
mechanical properties of films.  Appended below is a brief
description of the task group.  If you are interested in more
information about ASTM task group E080503 on Structural Films and
Electronic Materials and its ongoing round robins and standards
development, please contact me at [email protected].



Regards,

Chris


E08.05.03 on Structural Films and Electronic Materials




Task group E08.05.03 on Structural Films and Electronic Materials
develops standards for electronic and micromechanical applications. 
Technical issues include developing techniques for evaluating mechanical
properties of interest to the microelectronics and microelectromechanical
system (MEMS) industries. Current activities include:



=B7       Residual
Stress Measurement Round Robin

=B7       Symposia
and Workshops

=B7       Fatigue
of Solder Studies

=B7       Mechanical
Properties of Structural Films




Calendar of Events




Workshop on Fatigue and Fracture of Structural Films (November 17,
1999)

Symposium on Mechanical Properties of Structural Films (November 15-16,
2000)



For more information contact:

Chris Muhlstein

LBNL

1 Cyclotron Road

MS 62-203

Berkeley, CA  94720

[email protected]





At 01:07 PM 3/24/99 +0000, you wrote:

>Hello All,

>

>I'm looking for MEMS' specific reliability and long-term
stability

>standards, models, test methods and experimental results. Bulk

>micromachined sensors with anodic or fusion bonded wafers
(acceleration

>sensors, pressure sensors) are from special interest. Any
informations and

>suggestions will be deeply appreciated.

>

>Sincerely,

>Roumiana

>       

>       Dr. Roumiana
Paneva

>        &n=
bsp;      

>       X-FAB
GmbH

>       Haarbergstasse
61

>       D-99097
Erfurt

>       Deutschland

>       Tel: (+49)
361 42 053 21

>       FAX: (+49)
361 42 053 11

>       

> 

> 

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