Hello all,

     I am currently working with 15 micron thick, spin-on polyimide films.
     The films are hard-baked following patterning. Since these films are
     for a microwave/RF application (I'm fabricating tranmission lines on
     the polyimide, substrate is Si), I'm interested in measuring the
     dielectric constant and dielectric loss tangent for these films,
     following the curing step. I would like to know the variation in
     dielectric constant, loss tangent as a function of curing times,
     temperatures, etc...

     As far as I know the easiest way to do this is to fabricate a
     capacitor, with the polyimide as the dielectric and perform
     measurements usings the C-V meter.

     An alternative approach is to fabricate transmission lines, measure
     S-parameters, and extract the dielectric constant from the data...

     I'd be interested in performing an actual physical measurement, if
     possible, rather than rely on a functional device/component...

     Any suggestions would be appreciated...

     Thanks,

     Avi Kane
     Raytheon Systems Company
     askane@west.raytheon.com