MEMS Community,

I am interested in dicing up a 500 um quartz wafer into circular dice,
roughly 10 mm diameter. I have two questions:

1) What technologies and companies are available to do the cutting
(preferably in California)?

2) How do you hold the wafer and dice during cutting? If you hold the wafer
only, then the circular parts will fall into the cutting stream/beam and
get damaged. Is there a way to hold the individual dice? Is there a
substrate that doesn't get cut that you can "glue" to both the wafer and dice?

Any suggestions appreciated.

Thanks,

John D. Evans
Silicon Waterworks