Hi, Quanbo,

We used Pt as a barrier layer. But it is Ti/Pt/Au on Pyrex 7740. We also
performed Si/glass bonding at 380 Centidegree. No problem with that.

Pls keep me posted with all your answers. Thanks.

helen


>From: Zou Quanbo 
>Reply-To: Zou Quanbo , [email protected]
>To: [email protected]
>Subject: Cr/Au thermal-electric property
>Date: Mon, 27 Dec 1999 10:23:04 +0800
>
>Dear all,
>
>I experienced that the electric resistivity of Cr/Au bi-layer thin-film
>resistor was drastically increased after a thermal treatment. The process
>condition was: rough vacuum (~Torr), 380 degC, 2 hours. Cr/Au
>(thickness=1k/3k angstroms) are on Pyrex substrate (sputtered on). The
>resulted resistivity was ~20 times higher than un-treated samples.
>
>Does any one know what happened to this? I appreciate if somebody can help
>explain and maybe solve this problem.
>
>Thanks and best regards,
>
>Merry X'mas and Happy New Year!
>
>Quanbo Zou
>=================================
>Dr. Quanbo Zou
>MEMS Department
>Institute of Microelectronics
>11 Science Park Road
>Singapore Science Park II
>Singapore 117685
>Tel: 65-7705905(O) 65-2642113(H)
>Fax: 65-7731915
>Email: [email protected]
>================================
>

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