I'm looking for someone to do aligned wafer bonding using thermocompression
bonding  with various materials as the bonding medium (as opposed to direct
wafer bonding or anodic bonding).  This would be small quantity, experimental
scale work and working with a university lab would be just fine.  Any hints on
who I might contact?

Janet Rice
MCC
Senior Member Technical Staff
[email protected]
512-908-1490