Hi.  I am a graduate student at Stanford doing a class project for which
I need to bond aluminum thin foil (100 microns thick) onto a Si wafer.

The adhesive needs to withstand temperatures up to at least 350 C (because
there will be further processing and deposition on top of the Al).  I am
also worried about thermal expansion problems between the adhesive and
the Al (e.g I'd like the Al to be nice, flat and smooth when the wafer
returns to room temperature).

I was wondering if you had any suggestions, pointers, URLs, etc.
I am a newcomer to this area and don't really know where to start
looking.  Thank you in advance.

Sincerely,
Eric Pop.

epop@stanford.edu