Now I am now in the study of LIGA-like fabrication
and using SU-8 as the electroplated mold.

But when I finish the process of electrodeposition of Ni structure,
I am now suffering from the removal of the crosslinked SU-8.

Does anybody konw how to completetly remove SU-8 mold and also without
destroy or heave the Ni components?

In other words, is there any method to solve the polymeried SU-8 and
leave the Ni device alone on the substrate?

The SU-8 structure I have done is 500um thick and the minimum size of the Ni
posts
are 50um in diameter.

All I have the information was from MCC presently, but the remover I bought
from
them was too difficult to desolve the SU-8.

If you have any  fabrication parameter of SU-8, please mail to me,
especially in the removal
of that?

Thanks for your help.

--

Chien-Hung Ho
Mechanical Engineering,
National Chiao-Tung University,
Taiwan
e-mail:u8514583@cc.nctu.edu.tw