Dear Ladies and Gentlemen,

someone told me,

there would be a manufacturer, who offers an ultrasonic dice with the
following feature:
After the dicing of the wafer, the chips aren´t any more on a tape - they
just fall into the liquid, which is used for the ultra sonic. Out of this
liquid, they are somehow transported for further processing.

Can anybody help me, whom I might contact in that topic ?

Thank you - Harald Gundlach