Dear Sir,
There is a French (small) company wich may solve your problem :
GAMBERINI Sarl
http://www.microelectronics-sc.com/

Best regards.

Yahong Yao wrote:

> Hi, All,
>
> I wonder which company provides wafer dicing service? Mine is silicon
> substrate with MEMS devices on. I want to cut some trenches on the substrate
> so that the devices can be easily split after release.
> Thanks in advance.
>
> Yahong
> _______

--
Olivier de Gabrielli - Coordinateur Scientifique
A. C. M. I.
Association Capteurs, Mesure et Instrumentation.
Centre Universitaire de Formation et de
Recherche d'Archamps
Immeuble "Le Salève"
F - 74166 ARCHAMPS - France
Tel: 33 (0)450 31 55 10           Fax: 33 (0)450 31 57 21

mailto:[email protected]
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