Hi, there,

We want to develop low stress Al (about 1000A thick) deposition process by
DC magnetron sputter system.  The film should be low stress even after 150C
(preferrably, 350C) anneal.  Any suggestions about the process parameters ?

Thanks in advance.
Wenjiang
Foundry for Innovative Devices
Institite of Microelectronics, Singapore
wenjiang@ime.org.sg