Hello

I'm using SU-8 as a mold for the electroplating and having a problem with
adhesion.
Basically I spin on SU-8 5 (8um) on the Si nitride or oxide.  After
soft-bake, exposure, post-exposure bake, and developing, when I dice my
wafer into small pieces with a dicing saw, SU-8 film had peeled off from
the edge.  Did anyone experience the same thing?  Is there some way to
avoid this?

The recipe I used is following:
1. spincoat SU-8 5, 1500rpm, 30sec
2. soft-bake (hotplate) 15min @95degC (ramp up/down from 50degC)
3. exposure
4. post-exposure bake (hotplate) 30min @95degC (ramp up/down from 50 degC)
5. develop

*************************************
            Hiroaki Suzuki
  E-mail: hsuzuki@seas.ucla.edu
  Phone, Fax: 310-825-1350 (O)
  UCLA 18-111 Eng. 4
  420 Westwood Plaza
  Los Angeles, CA 90095
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