choong weng on wrote:

> Dear all,
>
>   I am looking for advice and comments on how to carry
> out multiple layer anodic bonding between silicon and
> borosilicate glass wafers.
>
>   Secondly, what are the methods I can use to drill
> holes (in the order of 1mm dia) in borosilicate glass.
>  Thank you very much.
>
> CHOONG Weng On
> National University of Singapore

One of the services we offer at Integrated Sensing Systems (ISSYS) is multiple
layer anodic bonding between silicon and glass wafers.  If you're interested,
please feel free to contact me.

Regards,

Sonbol Ansari

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Sonbol Massoud-Ansari
Director of External Services
Integrated Sensing Systems, Inc.
387 Airport Industrial Drive
Ypsilanti, MI 48198
Tel : (734) 547-9896 ext. 104
Fax : (734) 547-9964
Email : sonbol@mems-issys.com
WWW : http://www.mems-issys.com
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