I am having a problem that I hope some of you can help me with.  I
evaporate a thin seed layer of Ni on top of a quartz glass and then I
electroplate a thick layer (15microns) of Ni on top of the Ni seed layer.
When I heat the sample up (450C), the Ni peels off of the quartz. Is this
due to the fact that Ni inherently doesn't stick to quartz or is it due to
stress?  I have also used Ti/Cu as a seedlayer but the Ti/Cu seedlayer
peels off of the electroplated Ni. If anyone could give me some
DETAILED advice on this, I would greatly appreciate it.

Hyuk-Jeen Suh