Dear Michael,
you should either use Aluminum as sputtered metallization or - if you
need the gold on SiO - you should use a adhesion layer between gold an
SiO. You could try Ti, TiW, Cr, CrV or CrNi for example.
Best regards, Hermann
Michael Xiong schrieb:
> Dear MEMS colleague:
>
> I met some problem on gold wire bonding(packaging),
> and I highly appreciate your kind instructions.
>
> I grow SiO2 on Silicon wafer, then deposit gold film
> on the SiO2. When I make gold wire bonding to the gold
> film on SiO2, I met problem, the gold wire pull off a
> small hole on gold film after 1st bonding, it cannot
> stick with the gold film. Could you please give me
> some instructions? Any information is appreciated.
> Thank you in advance. My email: [email protected]
>
> have a nice day!
>
> Xiong
>
> __________________________________________________
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--
Dr. Hermann Oppermann
Fraunhofer IZM
Gustav-Meyer-Allee 25
D-13355 Berlin, Germany
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phone: +49-30-46403-163, -160
Fax: +49-30-46403-161
email: [email protected]
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Dept. Chip Interconnection Technologies
Group Optoelectronics, HF and Sensor Integration
http://www.izm.fhg.de/
http://www.izm.fhg.de/avt/index.htm
http://www.izm.fhg.de/avt/opperm.htm
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