Xiong:

Gold will not stick to SiO2. After you grow SiO2 on Si, deposit a thin layer
of Ti or Cr (few A thick), you can generate a mask to preferentially deposit
Ti or Cr at only those areas where you plan to deposit gold. After this step
try to deposit gold, the Ti or Cr thin layer bonds very well to Au and also
to Si or SiO2.

Jayant
*****************************************
Jayant Neogi
CEO
Norsam Technologies
Ph  503-640-0586/503-356-9197
Fax 503-640-8117/503-356-9197
http://www.norsam.com
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-----Original Message-----
From: Michael Xiong [mailto:[email protected]]
Sent: Monday, October 09, 2000 7:41 PM
To: [email protected]
Cc: [email protected]
Subject: gold wire bonding problem


Dear MEMS colleague:

I met some problem on gold wire bonding(packaging),
and I highly appreciate your kind instructions.

I grow SiO2 on Silicon wafer, then deposit gold film
on the SiO2. When I make gold wire bonding to the gold
film on SiO2, I met problem, the gold wire pull off a
small hole on gold film after 1st bonding, it cannot
stick with the gold film. Could you please give me
some instructions? Any information is appreciated.
Thank you in advance. My email: [email protected]

have a nice day!

Xiong

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