We are looking to do DRIE in the SOI device layer with the handle wafer of
the SOI pre-etched in some areas. (Si Fusion Bonding) This creates an
embedded cavity in certain areas  for the DRIE etch to terminate in.   Are
there any foundries out there
that can provide this process for us?

Gabe Smith
(301)744-1104 Office
(301)744-6406 Fax
Naval Surface Warfare Center- Indian Head Division
101 Strauss Ave. Bldg 302
Indianhead, MD 20640