Hi,

        Two options come to mind.
1. Use Acetic Acid as the diluent.  That is the alternate diluent in the
isotropic etching of Si.

2. If your process permits, KI+I2+Water etchant works fine.  We use water
to control the etch rate.

Good Luck.

-Ashutosh Shastry-

================================================================================
        Ashutosh Shastry                Research Associate,
        #30, Vihar House, IIT,          Microelectronics Group,
        Powai, MUMBAI, INDIA-76.        EE Department,
        Phone: 091-22-5721791           I.I.T. Bombay, INDIA 400 076.
        Email: [email protected]        Phone:091-22-5723655
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        O Traveller, there is no such thing as PATH...
                                        .....paths are MADE by walking.
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On Mon, 11 Dec 2000, Jerome Hauden wrote:

Hi all,

I'm currently using a mixture of Nitric and Chloridric acids as an Au etchant.
It works well but a bit to fast.
Does anyone has an idea with what can I dissolve it to slow down the
etching rate or where can I find that?
I tried water but of course it doesn't work well.

Many thanks.
Jerome