I have a dilemma that I was hoping the community could help
me with as I am sure that others have faced it in the past.
I have checked the archives and found only one slightly
relevent link.

I am putting together a project at present but the 2
principal partners process wafers on 6" and 4" wafers
respectively. Fortunately, the 6" processing is complete
before the 4" processing is required and so one way forward
might be to reduce the 6" wafers to 4" wafers between
processing at the respective partners.

* Is anyone aware of companies offering this wafer size
  reduction as a commercial service?

* Alternatively, is could anyone providfe advice on suitable
  techniques that may be applicable?

The technique used and edge profile obtained will obviously be
critical in determining yield to preventing crack propagation,
etc.).

Any advice / contact information would be gratefully received,

Karen Smith
Consultant Engineer
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