hi, dear fellows:
I am new on anodic bonding, I build a system and
trying on bonding 2mm thick boronfloat glass with
silicon wafer(with oxide), but the bonded pair always
crack a little bit. I guess it is because of high
stress. I have 2 question:

1. how to relieve the high stress in bonded pair?

2. Can I bonded silicon/silicon pair by anodic
bonding? do I have to cover them with oxide first?

tks a lot

Xin Tang

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