Dear MEMS colleagues:

I plan to fabricate Al surface-micromachining mirror
device using thick photoresist(AZ positive, about 6
microns) as sacrificial layer. I plan to use plasma
etching to realize the final releasing of the
structure. I wonder whether it's difficult to etch off
the photoresist sacrificial layer under the mirror
structure( about dimension of 100 microns in length
and 100 microns in width). Need I design some release
holes on the mirror surface to ensure releasing? Any
instructions are highly appreciated. Thank you very
much.

Best regards.

Xiong


__________________________________________________
Do You Yahoo!?
Get email at your own domain with Yahoo! Mail.
http://personal.mail.yahoo.com/