Dear all!
I need to find a material to fix temporary a foil of polyimide (PI) to a
silicon carrier substrate over its full area. The fixture is to
withstand 250°C bakeout and to be removed after processing of the PI by
e.g. solvent without leaving residues.
Has anybody an idea how to do that?
Thank you!

--
Erik Jung
Flatowallee 16/836
14055 Berlin
Fax: 030-30811297