Hi, everybody;
I would like to appreciate responders for following information (I got 5
responds) and forward these.
Thanks.
1.
From: Jing Liu [[email protected]]
Hi, Cheol,
You may like to take "Wafer Level Chip Scale Packaging(WL-CSP) An overview",
IEEE Transactions on Advanced Packaging. Vol.23, No.2, 2000 pp198-205, as a
reference.
I would also like to know other results you may get from the discussion
group.
Jing Liu
MEMS Lab.
Mechanical Engineering Dept.
Univ. of Maryland.
301-405-2981(0)
2.
From: Mark A. Shannon [[email protected]]
Cheol-Hyun - We are in the process of preparing a paper that describes
wafer to membrane bonding method with polymers at 300 C that can also be
used for wafer to wafer bonding that gives the strength of anodic to fusion
bonding. If you are interested, we can forward you a preprint when it is
done.
- Mark Shannon
3.
From: trung truong [[email protected]]
check the paper "polymer Bonding of micro-machined silicon structures," C.
den Besten, R.E.G. van Hal, (MEMS 92)
-trung
4.
From: Alderete, Michael [[email protected]]
You might start with John Lau's recent text "Low Cost Flip Chip Technologies
for DCA, WLCSP, and PBGA Assemblies," ISBN: 0071351418.
IEEE CPMT Journals [3 related journals as of recently] are a good up to date
source. See December volumes for their Annual Indices.
Advanced Packaging magazine
http://ap.pennnet.com/home.cfm
and HDI magazine
http://www.hdi-online.com/
are good sources as well.
Good luck,
Michael Alderete
Lead Mechanical Packaging Engineer
Sensor & Electronic Systems
The Boeing Company
3370 Miraloma Ave MC GB21 Bldg 231
P.O Box 3105
Anaheim CA 92803-3105
[email protected]
TEL (714) 762-2814
FAX (714) 762-6105
5.
From: [email protected]
There are several proven ways to perform wafer level bonding.
Silicon fuse bonding, thermocompression metal bonding and anodic bonding are
common but they have difficulties bonding over steps on the wafer. The
temperature for fuse bonding and the sodium from anodic bonding can also
cause problems.
Solder can be used to bond the wafers if solderable metal surfaces are first
deposited on both bond surfaces.
Silicon die attach materials and epoxies can be used. Patterned silicone die
attach was used by one manufacturer for a high volume MEMS device in the
early 90's.
Other polymers such as interlevel dielectric materials can sometimes by
bonded by thermocompression if they are partially cured before the bond
step.
And finally, glass pastes are used by several manufacturers.
[email protected] on 02/08/2001 06:14:39 PM
Please respond to [email protected]; Please respond to
[email protected]
To: [email protected]
cc: (bcc: Dan W Chilcott/DELCO)
Subject: wafer to wafer bonding with polymer intermediate (or adhesion) m
