Dear Chang-Fen Wan,

MOXTEK Inc. performs silicon etching for x-ray applications typically.  We
usually etch features with an aspect ratio of 50:1.  We frequently etch
trenches that are 25 micron wide and 760 microns deep.  The one capability
that MOXTEK has not acquired yet is the ability to process 6" wafers.
Currently we used 3" wafers.

You can contact me at the following address if desired.


Andrew J. Nielson
1260 N. 452 W.
Orem, Ut. 84057
801-225-0930
[email protected]

-----Original Message-----
From: Chang-Feng Wan [mailto:[email protected]]
Sent: Monday, July 09, 2001 7:12 PM
To: [email protected]
Subject: DRIE


Dear all:

I need to etch 75 microns deep, 2-3 microns wide trenches in 6" silicon. I
wonder if the Bosh DRIE process is capable of making such a high aspect
ratio.

Any information including name of the foundries who could do this will be
highly appreciated.

Thank you all.

Chan Wan


_________________________________________________________________
Get your FREE download of MSN Explorer at http://explorer.msn.com