Hi there,

I experienced that the electric resistivity of Cr/Ni thin-film
resistor was drastically increased after a thermal glass-glass bonding.
The Cr/Ni thin-film (200/2000 angstroms) was evaporated down the glass
sunbstrate using E-beam.The bonding process condition was: 650 degC, 6
hours. The resulted resistance was very huge. I suspected the Ni film
was oxidised during the bonding process because I didn't use vacuum condition.
I think the Pt could void this problem becase of its good thermal
property. Does any one know how to solve this problem? I appreciate your
help very much.

Wei