Dear MEMS experts,
I'd like to have some information about stamping.
We'd like to realize micro-packaging using a micro-cover (~2mm) which
must be glue to a wafer.
Do you think that stamping is a good solution to take the glue with the
cover?
Thank you very much.
Best regards

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Dr. Paolo Bondavalli
R&D Engineer
LABCOM - Laboratoire Interconnexions Optiques et MEMS
THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
Domaine de Corbeville,
Route Departementale 128
F91404 ORSAY
(FRANCE)
Tel : 01 69 33 08 63
Fax : 01 69 33 08 62
Email : [email protected]
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