On Tue, 04 Jun 1996 21:01:12 -0400 Jarlath McEntee wrote:
> Dear Group,
>
> I want to find some information on the strength of Silicon Fusion bonds
> between silicon wafers.  In particular I am interested in the strength
> of the bond in direct tension, in shear, and in bending.  Most of the
> information I can find in the litrature presents information on the
> surface energy of the bond.  Any papers presenting actual fracture
> strenghts of bonds gives fracture stresses in the range of 5 to 15 MPa.
>  This seems low for an interatomic bond.  Any clarifications available?
>
You're right - it is low compared to the GPa range for interatomic bonds.
However, it is more than good enough for applications using bonded wafers - try
pulling a well bonded pair apart!!

Cheers,

Dave Wood.