Hi,

We are trying to bond a pyrex wafer to a silicon wafer for optical
application. Between the pyrex and silicon, there must be a 1500 Angstrom
Niobium (Nb) oxide layer (which can be sputtered on either wafer). Can someone
suggest a reliable process for full wafer bonding? We prefer not to have
organic material in the process. Thanks.

Regards.

BJ