David Wood wrote:
>
> On Tue, 04 Jun 1996 21:01:12 -0400 Jarlath McEntee wrote:
>
> > Dear Group,
> >
> > I want to find some information on the strength of Silicon Fusion bonds
> > between silicon wafers.  In particular I am interested in the strength
> > of the bond in direct tension, in shear, and in bending.  Most of the
> > information I can find in the litrature presents information on the
> > surface energy of the bond.  Any papers presenting actual fracture
> > strenghts of bonds gives fracture stresses in the range of 5 to 15 MPa.
> >  This seems low for an interatomic bond.  Any clarifications available?
> >
> You're right - it is low compared to the GPa range for interatomic bonds.
However, it
> is more than good enough for applications using bonded wafers - try pulling a
well
> bonded pair apart!!
>
> Cheers,
>
Dave Wood.
Have you tried pulling wafers apart? If so do you have any results, numbers,
etc?