Dear MEMS colleagues:

I'm currently involved in a MEMS contact pressure
sensor project. Now the sensor is still at the wafer
level and I need to subdice the wafer. Usually water
was used to cool the dicing blade, but I'm afraid the
water flush may damage the micromachined structure.
Anyone can give me suggestions?

After subdicing, wire bonding is required for sensor
packaging. Because it's a contact sensor, I must make
sure that the wire won't break under external
pressure. How to solve this problem? Any suggestion is
highly appreciated.


Best regards,

Ebin
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