Dear all:

  I will do some photolithography steps after some corrugations formed
on the wafers. The depth of the corrugations are about 5~7 microns.
The corrugations are formed by this way: Etching silicon by SF6+O2,
namely RIE etching silicon.
  However, I found the effect of the photoresist spining was very bad,
even though I slow down the rev to 500 rpm. Could you give some advice
or share some experience with me? Any help will be greatly appreciated.

Thanks in advance,

Li Gang




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