A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: isotropic wet silicon etching.
isotropic wet silicon etching.
2001-11-05
li gang
2001-11-05
李佳鴻
2001-11-05
Klauder, Jr., Philip R.
isotropic wet silicon etching.
李佳鴻
2001-11-05
hi:
you can try:
   (1) LPCVD Silicon Nitride (Si3N4)
   (2) PECVD Silicon Carbide (SiC)

I did succeful Si isotropic etching with (1) as mask

----- Original Message -----
From: "li gang" 
To: 
Sent: Monday, November 05, 2001 4:49 PM
Subject: [mems-talk] isotropic wet silicon etching.


> Dear all:
>
>   Could you please share some isotropic wet silicon etching experience
> with me? I want to know the volume ratio of the HF:HNO3:HAC ,the etching
> rate and the mask. According to my reference, the etching rate of silicon
> is too quick (7 um/min) with SiO2 mask. I wonder if there is another good
> volume ratio to provide slower (less than 1um/min) silcion etching still
> with SiO2 as the mask.
>
> Thanks in advance,
>
> Regards,
>
> Li Gang
>
> _________________________________________________________________
> Get your FREE download of MSN Explorer at http://explorer.msn.com/intl.asp
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://fab.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.mems-exchange.org/

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Mentor Graphics Corporation
MEMS Technology Review
University Wafer
Addison Engineering