Dear Li,

Try contacting an EVG representative in your region. EVG developed a spray
coating system to deal with coating uniformity on topography.

Web site: www.EVGroup.com 
With best regards,

Helge



                -----Original Message-----
                From:   li gang [mailto:[email protected]]
                Sent:   Monday, November 05, 2001 3:23 AM
                To:     [email protected]
                Subject:        [mems-talk] Photoresist spining on
corrugated wafers

                Dear all:

                  I will do some photolithography steps after some
corrugations formed
                on the wafers. The depth of the corrugations are about 5~7
microns.
                The corrugations are formed by this way: Etching silicon by
SF6+O2,
                namely RIE etching silicon.
                  However, I found the effect of the photoresist spining was
very bad,
                even though I slow down the rev to 500 rpm. Could you give
some advice
                or share some experience with me? Any help will be greatly
appreciated.

                Thanks in advance,

                Li Gang





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