Hi Li,
There is a very good reference paper of photoresist coating and
photolithographic technique for topological surface.
You can find the paper from the technical digest of Transducer'01.

J.W. Kwon and E.S. Kim "Microfluidic Channel Routing With Protected Convex
Corners" pp.644-647.

Good luck.

Mark

----- Original Message -----
From: "Luesebrink Helge" 
To: "li gang" ; 
Sent: Monday, November 05, 2001 7:11 AM
Subject: RE: [mems-talk] Photoresist spining on corrugated wafers


> Dear Li,
>
> Try contacting an EVG representative in your region. EVG developed a spray
> coating system to deal with coating uniformity on topography.
>
> Web site: www.EVGroup.com 
> With best regards,
>
> Helge
>
>
>
> -----Original Message-----
> From: li gang [mailto:[email protected]]
> Sent: Monday, November 05, 2001 3:23 AM
> To: [email protected]
> Subject: [mems-talk] Photoresist spining on
> corrugated wafers
>
> Dear all:
>
>   I will do some photolithography steps after some
> corrugations formed
> on the wafers. The depth of the corrugations are about 5~7
> microns.
> The corrugations are formed by this way: Etching silicon by
> SF6+O2,
> namely RIE etching silicon.
>   However, I found the effect of the photoresist spining was
> very bad,
> even though I slow down the rev to 500 rpm. Could you give
> some advice
> or share some experience with me? Any help will be greatly
> appreciated.
>
> Thanks in advance,
>
> Li Gang
>
>
>
>
>
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