On Tue, 11 Jun 1996, Michael Young wrote:
> Dear MEMS,
>           I am currently having problems electroplating small nickel
> features (typically a few microns) through thick photoresist. I am unable
> to get the electroplating solution (Nickel sulphate based) into all the
> resist openings due to the high aspect ratios and small
> dimensions. I would be grateful if anyone could suggest a suitable
> wetting agent to overcome this problem.
>
> Cheers,
>         Mike Young.
>
>
>
Here at LSU, we use Lauryl Sulfate (about 1gram/l) as a wetting agent for
electroplating in high aspect ratio structures. So far we have been to
electroplate 1.8um diameter x 12um height holes. We've also made 10um diameter
x 100um posts.

Yohannes M. Desta
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