On Tue, 11 Jun 1996, Jack W. Judy wrote:
> ] Dear MEMS,
> ]           I am currently having problems electroplating small nickel
> ] features (typically a few microns) through thick photoresist. I am unable
> ] to get the electroplating solution (Nickel sulphate based) into all the
> ] resist openings due to the high aspect ratios and small
> ] dimensions. I would be grateful if anyone could suggest a suitable
> ] wetting agent to overcome this problem.
> ]
> ] Cheers,
> ]         Mike Young.
>
> Mike,
>
> Perhaps a pinch of the surfactant "Sodium Lauryl Sulfate" will do the trick.
> You will often find it listed on the back of shampoo bottles.
>
> If you add too much the bath will form a foamy head like a beer.
>
>
> -Jack
For MEMs-CMOS integration considerations, will this "Sodium Lauryl Sulfate"
produce free sodium which could be harmful to the MOS gate oxide?

_______________________________________________________________
Robert Antaki
laboratoire LISA, physique du solide
departement de genie physique, Ecole Polytechnique
Courrier-E: [email protected]
tel: (514) 340-3716   fax: (514) 340-3706   lab: (514) 340-3717