Hi,

    I met a question about SU-8 photoresist adhesion.
    I spun SU-8 on the SiO2/Si or Si3N4/Si substrate. After pattern the
SU-8, I put them into 30% KOH solution (80 degree C) to etch Si to form the
V-groove. However, SU-8 peeled off very quickly (just 1-2min) in the KOH
solution. The SU-8 is a part of my device and I want it to stay there after
KOH etching.
    Did anybody meet this problem and know how to solve it? Any suggestion
is high appreciation. Thanks in advance.

Regards,

Tao

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