Hi Jeff,

I have worked on a process fabricating surface micromachined pressure
sensors, and found that if after  a rinsing we dipped the wafers in
methanol (a low surface tension solution) for 4 mins, this reduced the
stiction problems.  There's also a good article comparing drying techniques
from a group in University of California

C. -J. Kim, J. Y. Kim and B. Sridharan, Comparitive evaluation of drying
techniques, Sensors and Acutators A 64 (1998) 17-26.

Hope this helps,

Helen.

Dr. Helen Berney
Transducers Group
National Microelectronics Research Centre, Prospect Row, Cork, Ireland.
Tel +353-21-4904010  Fax +353-21-4270271   Email [email protected]
http://www.nmrc.ucc.ie/research/transducers/index.html

jafar j babaei wrote:

> Hi all
>
> can anyone suggest an effective method to prevent sticking of released
> microstructures after rinsing?
>
> Thanks
> Jeff
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