Hi,
I heard about the use of Laser Ablation for Microengineering.
I would like to structure a material with Laser ablation method (after it
was spinned on a Si wafer)
and than to fill it with metal (by PVD, Electroplating, etc.).
Do you know what is the material that I should use structuring?
Do you know the resolution of the features that I can achieve with Laser
Ablation?


My Best Regards,
Lior Grossman
B.G. Technical Support Ltd