Hi Thomas,
Perhaps you can deposit the layer in several steps of 2-3um per dep with
annealing steps in between. This can reduce the overall stress due to
densification of the film.

-Mike Pedersen

Jon Doe wrote:

>  Hi all:
> We are trying to deposit 4 to 10 um thick PSG with 7
> to 14 wt% P in a Lam PECVD system. We are experiencing
> very high stress and the film cracks and peels of
> after an anneal.
> Has anybody experience with such thick doped glass
> films. If so, How did you overcome the stress?
>
> Thanks for your input.
>
> Thomas