This has been managed before by either growing very slowly or leaving
intervals for the film to relax.
20 microns is very thick and would probably take over a week.

John


At 17:48 16/12/2001 +0200, you wrote:
>Hi All,
>I am trying to deposit 20 microns of Aluminum in Evaporation or in
>Sputtering.
>However, the film is very stress (more stress in sputtering).
>Do you know a way to reduce the stress for such films?
>
>
>My Best Regards,
>Lior Grossman; Sales Manager
>B.G. Technical Support Ltd (www.bg-tech.co.il)
>_______________________________________________
>[email protected] mailing list: to unsubscribe or change your list
>options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
>Hosted by the MEMS Exchange, providers of MEMS processing services.
>Visit us at http://www.mems-exchange.org/