Hi All,

I'm going to do a deep 10 hour KOH etch of Silicon and am wondering what the
best mask is and how it should be applied.  What are the advantages and
disadvantages?  Residual stresses; Porosity; Temperature; Recomended
thickness; Deposition (LPCVD, PECVD); Thermal

SiO2?
SiN?
PSG?
etc...

Thank you

Ryan
[email protected]



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