Hi Sonia,

The parameters you asking about are very dependant on the plating solution.
Certain plating solutions require heating, Enthone Neutronix 309, and others
are best at room temperature. This is dependant on the organic additives as
well as plating ions involved. Each plating manufacturer has a specification
sheet which details this information.

Sincerely,
Walter Stonas
Process Development Engineer

-----Original Message-----
From: Sonia Garcia Blanco [mailto:sgblanco@elec.gla.ac.uk]
Sent: Friday, January 25, 2002 7:23 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Electroplating Gold


Dear All,

I am trying to electroplate gold on top of silica: for that I sputtered a
few nm Ti and then few nm of gold on top of the silica and place that in
the electroplating solution at 50C. I used a current of 50mA that will
give us around 2 micron thick layer of gold in 20min.

The surface appear with a lot of roughness.... Could somebody give me some
advice? Am I using the correct parameters for current and temperature to
get an uniform layer?

Thank you very much for your help!

Sonia.

*****************************************************

Sonia Garcia-Blanco

Department of Electronics and Electrical Engineering
University of Glasgow
Oakfield Ave.
G12 8LT
Glasgow

Phone:
   Office: (0141) 339 8855 ext 0101
   Lab:    (0141) 330 6014
Email: sgblanco@elec.gla.ac.uk

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