I have to etch Au layers of different thicknesses ranging from 100 nm to 2
um.
I found different chemicals to etch gold: (1) KI:I2:DI H20=4:1:40
(weight), (2) HCL:HNO3:DI=4:4:9 (volume), (3) HCL:HNO3:DI H20=3:1:?
("king's water")
Does anybody know about the selectivitiies of such etchants to Al
(!!), SiO2, SiN, Cr, Si. Do you have experiences with these etchants
regarding uniformity, etching rates, selectivity, suitable mask
materials? Which one could you recommend?
Thanks a lot for your answer(s).
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Joachim Oberhammer, Dipl.-Ing.
Royal Institute of Technology (KTH) Phone: +46/(0)8 790 6250
Dep. of Signals, Sensors and Systems Fax: +46/(0)8 10 0858
Microsystem Technology (MST) Mobile: +46/(0)70 692 1858
e-mail: [email protected]
Osquldas vdg 10 homepage: http://www.s3.kth.se/mst/
SE-100 44 Stockholm, Sweden
