Dear MEMS colleagues,

I will like to ask for help on 80-20 Au/Sn plating. I am
currently setting up a small plating bench @ school to
conduct selective plating of aforesaid eutectic bumps.

Please advise on any techniques, electrolytes (1-pot or 2-
pots), plated heights of each respective metal (for 2-
pots), or other feasible methods which I can perform in
lab, if possible.

If possible, I hope to have the ramp-up profiles for the
plated bumps as well.

Many thanks in advance.

Best,
RC, Singapore