I use Transene TFA Gold etchant, which is a solution of iodine and potassium
iodide. I don't believe it will significantly attack any of the other
materials you mentioned.
Roger Shile
>>> [email protected] 02/11/02 01:31AM >>>
I have to etch Au layers of different thicknesses ranging from 100 nm to 2
um.
I found different chemicals to etch gold: (1) KI:I2:DI H20=4:1:40
(weight), (2) HCL:HNO3:DI=4:4:9 (volume), (3) HCL:HNO3:DI H20=3:1:?
("king's water")
Does anybody know about the selectivitiies of such etchants to Al
(!!), SiO2, SiN, Cr, Si. Do you have experiences with these etchants
regarding uniformity, etching rates, selectivity, suitable mask
materials? Which one could you recommend?
Thanks a lot for your answer(s).
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